SK Hynix Secures 70% of Nvidia's HBM4 Orders
2025-01-30
South Korean memory chip giant SK Hynix has recently achieved a major breakthrough, successfully securing more than two-thirds of the HBM4 high-bandwidth memory supply orders for Nvidia's next-generation AI platform, Vera Rubin, with a share approaching 70%—far exceeding market expectations. Previously, SK Hynix completed a process upgrade at its core wafer fab in Wuxi, China, providing a solid foundation for its capacity expansion and technological leadership.
HBM4 Order Breakthrough
Market research firm Counterpoint Research predicts that in the global HBM4 market in 2026, SK Hynix will capture 54% market share, followed by Samsung Electronics with 28% and Micron Technology with 18%. This landscape reflects the technological advantages and customer trust that SK Hynix has accumulated over the long term in the HBM field.
HBM Technology Leadership
The key to SK Hynix's ability to stand out in the HBM4 competition lies in its establishment of a mature mass production system ahead of competitors. Since September 2025, the company has built up its HBM4 mass production system and provided numerous paid samples to Nvidia.
During the sample validation phase, SK Hynix's products exhibited no major issues and demonstrated excellent yield rates, which became the core competitiveness in securing these large orders. Nvidia and AMD have also recently completed quality testing of Samsung's HBM4 products, with formal supply expected to begin in February 2026, but Samsung has clearly fallen behind SK Hynix in terms of mass production timing.
As the sixth-generation high-bandwidth memory technology, HBM4's base logic die (Base Die) adopts more advanced processes (such as TSMC's 12nm or 5nm) for the first time, placing higher demands on manufacturers' technological integration capabilities. SK Hynix's technical reserves in this field have earned it a first-mover advantage.
Critical Process Upgrade at Wuxi Fab
To support large-scale HBM4 supply, SK Hynix recently completed a process upgrade at its Wuxi, China facility. As SK Hynix's core base for DRAM production, this fab has successfully upgraded its process from the original 1z nm (third-generation 10-nanometer class) to the more advanced 1a nm (fourth-generation 10-nanometer class).
Currently, the Wuxi fab has a monthly DRAM capacity of approximately 180,000 to 190,000 12-inch wafers, of which about 90% have completed conversion to the 1a process. This upgrade enables the Wuxi fab to produce DRAM products with better performance and lower power consumption, while significantly increasing output per wafer. This facility accounts for 30% to 40% of SK Hynix's global DRAM production, making it one of the company's most critical manufacturing bases. Against the backdrop of U.S. semiconductor equipment export controls on China, the successful completion of this upgrade has eliminated market concerns about potential supply disruptions.
HBM4 Market Outlook
SK Hynix's expansion pace aligns highly with the explosive growth in AI infrastructure demand. SK Hynix recently announced that it expects the HBM4 shortage to worsen in the second half of 2026, as customer demand continues to surge.
In addition to Nvidia, SK Hynix has also secured exclusive supply qualification for HBM3E for Microsoft's new AI chip, Maia 200. Meanwhile, the company plans to establish an AI solutions company in the United States (tentatively named AI Company) to tap into new growth engines in the AI field.
Semicone Distributor
Semicon is a distributor specializing in high-performance integrated circuits, focusing on analog and mixed-signal ICs, power management chips, sensors, and microcontrollers, among others. The best-selling IC components of Semicon include high-efficiency DC/DC converters, low-power linear regulators, high-performance FPGAs, and power MOSFETs, etc. Here are several selected electronic components.
● LTM8055IY#PBF: A 58V, 3.5A step-down μModule regulator with integrated inductor, ideal for industrial and automotive power applications requiring high voltage input and compact footprint.
● TPS79918QDDCRQ1: An automotive-grade, ultra-low noise 200mA LDO regulator optimized for RF and precision analog power supplies in infotainment and ADAS systems.
● XC6VLX75T-1FF484I: A high-performance Virtex-6 FPGA featuring 75K logic cells and advanced DSP slices, designed for demanding aerospace, defense, and high-speed communications applications.
● IRF7103TRPBF: A dual N-channel HEXFET power MOSFET combining fast switching performance and low on-resistance, well-suited for synchronous rectification and DC-DC converter topologies.
Email: info@semicone.com
Kioxia and SanDisk Extend Five-Year Partnership: Largest FlashMemory Joint Factory
ASML Announces 1,700 Layoffs, Targeting Management Ranks
Related Article
Trump administration advances second-phase chip tariffs. Invest in U.S. production for exemptions,overseas makers face heavy duties on American-bound semiconductors.
U.S. to Implement Targeted Semiconductor Tariffs
Soitec, commanding ~95% of Photonics-SOI substrate share, secures long-term orders with deposit-backed capacity locks to prevent overbooking.
Silicon Photonics Demand Surges, Soitec Locks In Capacity via Long-Term Contracts
